On the thickness of Cu6Sn5 compound at the anode of Cu/liquid Sn/Cu joints undergoing electromigration
Crossref DOI link: https://doi.org/10.1007/s10854-016-4756-2
Published Online: 2016-04-16
Published Print: 2016-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kunwar, Anil
Ma, Haoran
Ma, Haitao
Guo, Bingfeng
Meng, Zhixian
Zhao, Ning
Huang, Mingliang
Funding for this research was provided by:
National Natural Science Foundation of China (51571049, 51301030)
Text and Data Mining valid from 2016-04-16