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Influence of polyimide on thermal stress evolution in polyimide/Cu thick film composite

Crossref DOI link: https://doi.org/10.1007/s10854-016-4841-6

Published Online: 2016-04-29

Published Print: 2016-08

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Li, Heng

Cheng, Gong

Xu, Gaowei

Luo, Le
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (NSFC61574154)

Natural Science Foundation of Shanghai (No. 13ZR1447300)
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