Effect of repeated thermal cycles on thermal stress in copper paste films on alumina substrates
Crossref DOI link: https://doi.org/10.1007/s10854-016-4858-x
Published Online: 2016-05-12
Published Print: 2016-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Fukuda, Shinji
Shimada, Kazuhiko
Izu, Noriya
Miyazaki, Hiroyuki
Hirao, Kiyoshi
Text and Data Mining valid from 2016-05-12