An investigation on the ZnO retained ratio, microstructural evolution, and mechanical properties of ZnO doped Sn3.0Ag0.5Cu composite solder joints
Crossref DOI link: https://doi.org/10.1007/s10854-016-4943-1
Published Online: 2016-05-06
Published Print: 2016-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Peng, Hao
Chen, Guang
Mo, Liping
Chan, Y. C.
Wu, Fengshun
Liu, Hui
Funding for this research was provided by:
National Natural Science Foundation of China (CN) (61261160498)
Research Grants Council of Hong Kong (CityU101/12)
Text and Data Mining valid from 2016-05-06