Fabrication of silver electrically conductive adhesive to apply in through-hole filling for PCB interconnection
Crossref DOI link: https://doi.org/10.1007/s10854-016-4955-x
Published Online: 2016-05-11
Published Print: 2016-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhou, Guoyun
Mao, Yingjie
Wang, Chong
Wang, Shouxu
Chen, Yuanming
He, Wei
Funding for this research was provided by:
Guangdong Major Project of Industry University Research Corporation (2013A090100005)
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