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Subgrain rotation at twin grain boundaries of a lead-free solder joint during thermal shock

Crossref DOI link: https://doi.org/10.1007/s10854-016-5022-3

Published Online: 2016-05-25

Published Print: 2016-09

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Tan, Shihai

Han, Jing

Guo, Fu
Funding

Funding for this research was provided by:

Scientific Research Project of Beijing Municipal Commission of Education (KZ201410005009)

National Natural Science Foundation of China (No. 51401006)

Beijing Natural Science Foundation (No. 2162005)
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