Effect of multiple flip-chip assembly on the mechanical reliability of eutectic Au–Sn solder joint
Crossref DOI link: https://doi.org/10.1007/s10854-016-5063-7
Published Online: 2016-05-30
Published Print: 2016-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chu, Kunmo
Park, Sunghoon
Lee, Changseung
Sohn, Yoonchul
Text and Data Mining valid from 2016-05-30