Harsh service environment effects on the microstructure and mechanical properties of Sn–Ag–Cu-1 wt% nano-Al solder alloy
Crossref DOI link: https://doi.org/10.1007/s10854-016-5250-6
Published Online: 2016-06-28
Published Print: 2016-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Gain, Asit Kumar
Zhang, Liangchi
Funding for this research was provided by:
The University of New South Wales (InfoEd Ref: RG124326)
License valid from 2016-06-28