Column-grid-array (CGA) versus ball-grid-array (BGA): board-level drop test and the expected dynamic stress in the solder material
Crossref DOI link: https://doi.org/10.1007/s10854-016-5288-5
Published Online: 2016-07-12
Published Print: 2016-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Suhir, E.
Ghaffarian, R.
License valid from 2016-07-12
