Crossmark

Creep behavior of micro-scale Cu/Sn–3.0Ag–0.5Cu/Cu joints under electro-thermo-mechanical coupled loads

Crossref DOI link: https://doi.org/10.1007/s10854-016-5443-z

Published Online: 2016-08-06

Published Print: 2016-12

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Li, W. Y.

Jin, H.

Yue, W.

Tan, M. Y.

Zhang, X. P.
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (51275178)

Research Fund for the Doctoral Program of Higher Education of China (20110172110003)
License Information

License valid from 2016-08-06