The low temperature exothermic sintering of formic acid treated Cu nanoparticles for conductive ink
Crossref DOI link: https://doi.org/10.1007/s10854-016-5476-3
Published Online: 2016-08-12
Published Print: 2016-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Liu, Jingdong
Ji, Hongjun
Wang, Shuai
Li, Mingyu
License valid from 2016-08-12
