Influence of latent heat released from solder joints II: PCB deformation during reflow and pad cratering defects
Crossref DOI link: https://doi.org/10.1007/s10854-016-5630-y
Published Online: 2016-08-31
Published Print: 2017-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Dušek, Karel
Rudajevová, Alexandra
Funding for this research was provided by:
Grant Agency of the Czech Technical University in Prague (SGS15/196/OHK3/3T/13)
Czech Research Infrastructures Program (LM 2011025)
License valid from 2016-08-31