A new fabrication process of TGV substrate with silicon vertical feedthroughs using double sided glass in silicon reflow process
Crossref DOI link: https://doi.org/10.1007/s10854-016-6005-0
Published Online: 2016-11-11
Published Print: 2017-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Li, Wenyin
Xiao, Dingbang
Wu, Xuezhong
Hou, Zhanqiang
Chen, Zhihua
Wang, Xinghua
Zhou, Jian
License valid from 2016-11-11