Creep behavior of Sn–Bi solder alloys at elevated temperatures studied by nanoindentation
Crossref DOI link: https://doi.org/10.1007/s10854-016-6031-y
Published Online: 2016-11-10
Published Print: 2017-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Shen, Lu
Wu, Yuanyuan
Wang, Shijie
Chen, Zhong
License valid from 2016-11-10