Formation mechanism and kinetic analysis of the morphology of Cu6Sn5 in the spherical solder joints at the Sn/Cu liquid–solid interface during soldering cooling stage
Crossref DOI link: https://doi.org/10.1007/s10854-016-6200-z
Published Online: 2016-12-20
Published Print: 2017-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Guo, Bingfeng
Ma, Haitao
Jiang, Chengrong
Wang, Yunpeng
Kunwar, Anil
Zhao, Ning
Huang, Mingliang
Funding for this research was provided by:
National Natural Science Foundation of China (51571049, 51301030)
License valid from 2016-12-20