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Pressureless sintering bonding using hybrid microscale Cu particle paste on ENIG, pure Cu and pre-oxidized Cu substrate by an oxidation–reduction process

Crossref DOI link: https://doi.org/10.1007/s10854-016-6220-8

Published Online: 2016-12-20

Published Print: 2017-04

Update policy: https://doi.org/10.1007/springer_crossmark_policy