Investigation of moisture uptake into printed circuit board laminate and solder mask materials
Crossref DOI link: https://doi.org/10.1007/s10854-016-6292-5
Published Online: 2017-01-05
Published Print: 2017-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Conseil-Gudla, Hélène
Gudla, Visweswara C.
Borgaonkar, Shruti
Jellesen, Morten S.
Ambat, Rajan
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