Microstructure evolution and shear behavior of Au–Sn/Ni–xCo (x = 20, 40, 60, and 80 at.%) joints soldered at 350 °C
Crossref DOI link: https://doi.org/10.1007/s10854-017-6413-9
Published Online: 2017-01-30
Published Print: 2017-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Peng, J.
Wang, R. C.
Wang, M.
Liu, H. S.
Funding for this research was provided by:
Department of S and T for Social Development (JPPT-125-GH-039)
License valid from 2017-01-30