Cu–Sn and Ni–Sn transient liquid phase bonding for die-attach technology applications in high-temperature power electronics packaging
Crossref DOI link: https://doi.org/10.1007/s10854-017-6479-4
Published Online: 2017-02-06
Published Print: 2017-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lee, Byung-Suk
Hyun, Soong-Keun
Yoon, Jeong-Won
License valid from 2017-02-06