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Effect of high temperature high humidity and thermal shock test on interfacial intermetallic compounds (IMCs) growth of low alpha solders

Crossref DOI link: https://doi.org/10.1007/s10854-017-6518-1

Published Online: 2017-02-24

Published Print: 2017-06

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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