Crack generation in electroless nickel plating layers on copper-metallized silicon nitride substrates during thermal cycling
Crossref DOI link: https://doi.org/10.1007/s10854-017-6541-2
Published Online: 2017-02-24
Published Print: 2017-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Fukuda, Shinji
Shimada, Kazuhiko
Izu, Noriya
Miyazaki, Hiroyuki
Iwakiri, Shoji
Hirao, Kiyoshi
License valid from 2017-02-24