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Simplified low-temperature wafer-level hybrid bonding using pillar bump and photosensitive adhesive for three-dimensional integrated circuit integration

Crossref DOI link: https://doi.org/10.1007/s10854-017-6642-y

Published Online: 2017-03-13

Published Print: 2017-06

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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