Effect of isothermal aging on microstructure, electrical resistivity and damping properties of Sn–Ag–Cu solder
Crossref DOI link: https://doi.org/10.1007/s10854-017-6675-2
Published Online: 2017-03-04
Published Print: 2017-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Gain, Asit Kumar
Zhang, Liangchi
Funding for this research was provided by:
University of New South Wales (InfoEd Ref: RG124326)
License valid from 2017-03-04