Electrical resistivity and creep behavior of hypoeutectic Sn–0.5Cu based solders for flip chip technology
Crossref DOI link: https://doi.org/10.1007/s10854-017-7032-1
Published Online: 2017-04-29
Published Print: 2017-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
El-Khawas, E. H.
El-Hosainy, H.
El-Daly, A. A.
License valid from 2017-04-29
