Effect of Sn crystallographic orientation on solder electromigration and Ni diffusion in Cu/Ni plating/Sn–0.7Cu joint at low current density
Crossref DOI link: https://doi.org/10.1007/s10854-017-7087-z
Published Online: 2017-05-19
Published Print: 2017-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kadoguchi, Takuya
Sakai, Tsubasa
Sei, Tsubasa
Take, Naoya
Yamanaka, Kimihiro
Nagao, Shijo
Suganuma, Katsuaki
License valid from 2017-05-19