Effect of in-situ free air ball laser heating on bonding strength and grain structure for copper wire bond
Crossref DOI link: https://doi.org/10.1007/s10854-017-7219-5
Published Online: 2017-05-30
Published Print: 2017-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Singh, Gurbinder https://orcid.org/0000-0001-9204-1659
Haseeb, A. S. M. A.
License valid from 2017-05-30