Electroless deposition of pure copper film on carbon fabric substrate using hydrazine as reducing agent
Crossref DOI link: https://doi.org/10.1007/s10854-017-7234-6
Published Online: 2017-06-01
Published Print: 2017-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Liao, Fan
Han, Xingrong
Xu, Chunju
Chen, Huiyu
License valid from 2017-06-01
