Effect of silicone resin modification on the performance of epoxy materials for LED encapsulation
Crossref DOI link: https://doi.org/10.1007/s10854-017-7316-5
Published Online: 2017-06-14
Published Print: 2017-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wen, Ruiheng
Huo, Jizhen
Lv, Jie
Liu, Zhuoyu
Yu, Yingfeng http://orcid.org/0000-0002-2607-0416
Funding for this research was provided by:
National Natural Science Foundation of China (21274031)
License valid from 2017-06-14