Effects of aging temperature on tensile and fatigue behavior of Sn-3.0Ag-0.5Cu solder joints
Crossref DOI link: https://doi.org/10.1007/s10854-017-7360-1
Published Online: 2017-06-19
Published Print: 2017-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wang, Jundong
Long, Xu
Yao, Yao
Funding for this research was provided by:
National Natural Science Foundation of China (11572249)
License valid from 2017-06-19