Flip-chip assembly: is the bi-material model acceptable?
Crossref DOI link: https://doi.org/10.1007/s10854-017-7471-8
Published Online: 2017-07-15
Published Print: 2017-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Suhir, Ephraim
License valid from 2017-07-15