Microstructure, wetting characteristics and hardness of tin-bismuth-silver (Sn–Bi–Ag) solders on silver (Ag)-surface finished copper (Cu) substrates
Crossref DOI link: https://doi.org/10.1007/s10854-017-7611-1
Published Online: 2017-07-29
Published Print: 2017-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Fouzder, Tama
Gain, Asit Kumar
Chan, Daniel K.
License valid from 2017-07-29