Effects of reduced graphene oxide film on bonding interfaces between Cu microcones and 25 μm Sn/Cu bumps
Crossref DOI link: https://doi.org/10.1007/s10854-017-7670-3
Published Online: 2017-08-18
Published Print: 2017-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ju, Longlong
Sun, Menglong
Ye, Lei
Zhang, Liangzhao
Hu, Anmin
Li, Ming
Funding for this research was provided by:
National Natural Science Foundation of China (61376107)
License valid from 2017-08-18