Size effect on microstructure and tensile properties of Sn3.0Ag0.5Cu solder joints
Crossref DOI link: https://doi.org/10.1007/s10854-017-7706-8
Published Online: 2017-08-19
Published Print: 2017-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wang, Shaobin
Yao, Yao
Long, Xu
Funding for this research was provided by:
National Natural Science Foundation of China (11572249)
License valid from 2017-08-19