Further insight into interfacial interactions in nickel/liquid Sn–Ag solder system at 230–350 °C
Crossref DOI link: https://doi.org/10.1007/s10854-017-7783-8
Published Online: 2017-08-24
Published Print: 2017-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Taneja, Divya
Volpert, Marion
Hodaj, Fiqiri
Text and Data Mining valid from 2017-08-24
Version of Record valid from 2017-08-24
Article History
Received: 27 June 2017
Accepted: 20 August 2017
First Online: 24 August 2017