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Microstructure, hardness, and shear behavior of the as-soldered SnBi–SAC composite solder pastes

Crossref DOI link: https://doi.org/10.1007/s10854-017-7866-6

Published Online: 2017-09-08

Published Print: 2017-12

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Liu, Yang https://orcid.org/0000-0002-4311-2198
Fu, Haifeng

Zhang, Hao

Sun, Fenglian

Wang, Xuan

Zhang, Guoqi
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Text and Data Mining valid from 2017-09-08

Version of Record valid from 2017-09-08
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Article History

Received: 20 June 2017

Accepted: 5 September 2017

First Online: 8 September 2017