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Investigation on the effects of low-temperature anodic bonding and its reliability for MEMS packaging using destructive and non-destructive techniques

Crossref DOI link: https://doi.org/10.1007/s10854-017-7908-0

Published Online: 2017-10-04

Published Print: 2018-01

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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