Crossmark

Effect of bonding time on the microstructure and mechanical properties of Co/Sn/Cu joint

Crossref DOI link: https://doi.org/10.1007/s10854-017-7934-y

Published Online: 2017-10-10

Published Print: 2018-01

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Du, Chengchao

Wang, Xue

Tian, Shuang
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (51374153 and 51574181)

State Key Lab of Advanced Welding and Joining (AWJ-Z15-02)
License Information

License valid from 2017-10-10