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Synchrotron radiation imaging study on the rapid IMC growth of Sn–xAg solders with Cu and Ni substrates during the heat preservation stage

Crossref DOI link: https://doi.org/10.1007/s10854-017-7951-x

Published Online: 2017-11-08

Published Print: 2018-01

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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