Crossmark

Effect of initial Cu concentration on the IMC size and grain aspect ratio in Sn–xCu solders during multiple reflows

Crossref DOI link: https://doi.org/10.1007/s10854-017-7952-9

Published Online: 2017-10-23

Published Print: 2018-01

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Ma, Haitao https://orcid.org/0000-0002-8299-6459
Ma, Haoran

Kunwar, Anil

Shang, Shengyan

Wang, Yunpeng

Chen, Jun

Huang, Mingliang

Zhao, Ning
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (CN) (51571049, 51675080)

China Postdoctoral Science Foundation (CN) (2017M611215)
License Information

License valid from 2017-10-23