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Nanoindentation creep on Cu3Sn, Cu6Sn5 and (Cu, Ni)6Sn5 intermetallic compounds grown in electrodeposited multilayered thin film

Crossref DOI link: https://doi.org/10.1007/s10854-017-8030-z

Published Online: 2017-10-23

Published Print: 2018-01

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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