Analytical thermal stress model for a typical flip-chip (FC) package design
Crossref DOI link: https://doi.org/10.1007/s10854-017-8194-6
Published Online: 2017-11-24
Published Print: 2018-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Suhir, E.
License valid from 2017-11-24