Microstructure evolution during reflow and thermal aging in a Ag@Sn TLP bondline for high-temperature power devices
Crossref DOI link: https://doi.org/10.1007/s10854-017-8232-4
Published Online: 2017-11-14
Published Print: 2018-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Guo, Qiang
Yu, Fuwen
Chen, Hongtao
Li, Mingyu
Funding for this research was provided by:
National Natural Science Foundation of China (51375116)
The Science and Technology Project of Shenzhen (JCYJ20160318095308401)
License valid from 2017-11-14