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Effects of In addition on the wettability, interfacial characterization and properties of ternary Sn–Cu–Ni solders

Crossref DOI link: https://doi.org/10.1007/s10854-018-0009-x

Published Online: 2018-09-08

Published Print: 2018-11

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Hu, Xiaowu

Lai, Yanqing

Jiang, Xiongxin

Li, Yulong
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (51465039)

National Natural Science Foundation of China (51665038)

National Natural Science Foundation of China (51765040)

Natural Science Foundation of Jiangxi Province (20161BAB206122)
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Article History

Received: 30 July 2018

Accepted: 4 September 2018

First Online: 8 September 2018