Fabrication of high-temperature-resistant bondline based on multilayer core–shell hybrid microspheres for power devices
Crossref DOI link: https://doi.org/10.1007/s10854-018-00637-7
Published Online: 2019-01-02
Published Print: 2019-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yu, Fuwen
Chen, Hongtao http://orcid.org/0000-0003-0024-2539
Hang, Chunjin
Li, Mingyu
Funding for this research was provided by:
the Science and Technology Project of Shenzhen (JCYJ20160318095308401)
Text and Data Mining valid from 2019-01-02
Article History
Received: 13 October 2018
Accepted: 24 December 2018
First Online: 2 January 2019