Thermal and mechanical properties of micro Cu doped Sn58Bi solder paste for attaching LED lamps
Crossref DOI link: https://doi.org/10.1007/s10854-018-0298-0
Published Online: 2018-11-02
Published Print: 2019-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhang, Hao
Sun, Fenglian
Liu, Yang
Funding for this research was provided by:
National Natural Science Foundation of China (51174069)
Text and Data Mining valid from 2018-11-02
Article History
Received: 26 September 2018
Accepted: 26 October 2018
First Online: 2 November 2018