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Microstructure evolution and tensile creep behavior of Sn–0.7Cu lead-free solder reinforced with ZnO nanoparticles

Published Online: 2018-12-10

Published Print: 2019-02

Authors

Abd El-Rehim, A. F.

Zahran, H. Y.

Yassin, A. M.
Funding

Funding for this research was provided by:

King Khalid University (Grant number (G.R.P- 240-39).)
License Information

Text and Data Mining valid from 2018-12-10
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Article History

Received: 13 October 2018

Accepted: 30 November 2018

First Online: 10 December 2018

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