Effect of curing agent and curing substrate on low temperature curable silver conductive adhesive
Crossref DOI link: https://doi.org/10.1007/s10854-018-0559-y
Published Online: 2019-01-02
Published Print: 2019-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wang, Xiao-Qing http://orcid.org/0000-0001-8702-4598
Gan, Wei-Ping
Xiang, Feng
Li, Bi-Yuan
Text and Data Mining valid from 2019-01-02
Article History
Received: 30 September 2018
Accepted: 12 December 2018
First Online: 2 January 2019
Compliance with ethical standards
:
: The authors declare that they have no competing interests.