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Latest advancement of fully additive process for 8 µm ultra-fine pitch chip-on-film (COF) by nano-size Ni–P metallization

Crossref DOI link: https://doi.org/10.1007/s10854-018-8680-5

Published Online: 2018-01-31

Published Print: 2018-04

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Pun, Kelvin P. L.

Ali, Lafir

Kohtoku, Makoto

Cheung, Chee-Wah

Chan, Alan H. S.

Wong, C. P.
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Text and Data Mining valid from 2018-01-31
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Article History

Received: 10 November 2017

Accepted: 25 January 2018

First Online: 31 January 2018