Effect of bismuth–tin alloy particle diameter on bonding strength of copper nanoparticles/bismuth–tin solder hybrid joints
Crossref DOI link: https://doi.org/10.1007/s10854-018-8704-1
Published Online: 2018-02-02
Published Print: 2018-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Satoh, Toshikazu
Ishizaki, Toshitaka
Usui, Masanori
Text and Data Mining valid from 2018-02-02
Version of Record valid from 2018-02-02
Article History
Received: 31 August 2017
Accepted: 30 January 2018
First Online: 2 February 2018