Annealing effect to constitutive behavior of Sn–3.0Ag–0.5Cu solder
Crossref DOI link: https://doi.org/10.1007/s10854-018-8705-0
Published Online: 2018-02-02
Published Print: 2018-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Long, Xu http://orcid.org/0000-0002-3212-9154
Tang, Wenbin
Wang, Shaobin
He, Xu
Yao, Yao
Text and Data Mining valid from 2018-02-02
Version of Record valid from 2018-02-02
Article History
Received: 11 October 2017
Accepted: 30 January 2018
First Online: 2 February 2018